congatec introduces 3.5-inch application carrier board for COM-HPC Mini modules
Deggendorf/Nuremberg, Germany, April 9th, 2024 * * * congatec – a leading provider of embedded and edge computing technology – presents the first board-level product in line with its recently introduced aReady. strategy. Application-ready for immediate deployment in industrial use cases, the new 3.5-inch conga-HPC/3.5-Mini carrier board is designed for space-constrained rugged high-performance IIoT applications that […]
congatec presents new SMARC modules on the basis of the NXP i.MX 95 processor series
Deggendorf, 9 July 2024 * * * congatec – a leading provider of embedded and edge computing technology – presents new high-performance computer-on-modules (COMs) with i.MX 95 processors from NXP, thereby expanding its extensive module portfolio with low-power NXP i.MX Arm processors. In doing so, congatec underlines its strong partnership with NXP. Customers benefit from straightforward scalability […]