EMI/RFI
EPS offers special shielding solutions through our in house facility, dispensing conductive gaskets utilizing “form in place” technology.
[fusion_slider hover_type=”none” width=”100%” height=”100%” hide_on_mobile=”small-visibility,medium-visibility,large-visibility” class=”” id=””][fusion_slide type=”image” image_id=”12665|800″ link=”” lightbox=”no” linktarget=”_self”]https://eps-tech.com/dev/wordpress/wp-content/uploads/2018/11/fip1-800×600.jpg[/fusion_slide][fusion_slide type=”image” image_id=”12664|full” link=”” lightbox=”no” linktarget=”_self”]https://eps-tech.com/dev/wordpress/wp-content/uploads/2018/11/form-in-place-2.jpg[/fusion_slide][/fusion_slider]
“Form-in-Place” technology allows intricate, small cross-section gaskets to be dispensed directly onto any conductively painted, plated, or metallic surface of an electronic enclosure that requires conductive and/or environmental sealing. This cost effective solution offers more than 75 dB shielding effectiveness from 200 MHz to 18 GHz with a potential space savings of 50%.
The dispensed gaskets cure and adheres ‘in-situ’ to form a resilient and reusable EMI/environmental seal. The gaskets cure at room temperature, making the process compatible with plastic housings or heat sensitive components.
Typical applications include cellular phone handsets, ‘shield cans’, communication base stations, connector housings, and complex 3D enclosures.
Various gaskets compounds are used to achieve different degrees of flexibility, or electrical compatibility with the base material on which the gasket is dispensed.