Introduction

Intel^® Xeon^® D processors, enhanced for IoT, are a high-density platform that packs server-class computing and I/Os, plus accelerated AI, into compact BGA packages for soldered-down embedded and rugged designs. ​

Extended operating temperature ranges and industrial-class reliability make Intel^® Xeon^® D-1700 and D-2700 SoCs ideal for high-performance rugged equipment and sealed fanless devices that must run nonstop in the toughest environments.​

MIL-STD Environment

• Operating Temperature High: 50°C, MIL-STD-810G, Method 501.5, Procedure I
• Operating Temp Low: 0°C, MIL-STD-810G, Method 502.5, Procedure I
• Non-Operating Temperature High: 70°C, MIL-STD-810G, Method 501.5, Procedure II
• Non-Operating Temperature Low: -40°C, MIL-STD-810G, Method 502.5, Procedure II
• Operating Altitude: Up to 15,000 ft., MIL-STD-810G, Method 500.5
• Non-Operating Altitude: Up to 45,000 ft., MIL-STD-810G, Method 500.5
• Humidity: MIL-STD-810G, Method 507.5, Procedure Ib (Natural Cycle B3)
• Shock: MIL-STD-810G, Method 516.6, 30 g’s, Saw-tooth, 11ms & MIL-DTL-901E, Grade A, Class II; Type B
• Vibration: MIL-STD-167, Type I, Deck Mounted Equipment
• EMI/EMC: MIL-STD-461F, RE101, RE102 (Shipboard Level 1), RS103, CE101, CE102, CS101, CS114, CS116
• Airborne Noise: MIL-STD-740-1 compliance: 43.7dBA (Idle), 52.5dBA (50%), 54.6dBA (80%).