Formfactor COM Express Compact
DRAM
2 SO-DIMM sockets for DDR5 memory modules up to 48 GB each (max. 96 GB RAM system capacity) |up to 5600 MT/s | in-band ECC
Ethernet
2.5 GbE with TSN support via Intel® i226 Ethernet controller series
I/O Interfaces
Up to 8 PCIe Gen5 PEG (H-Series) or up to 2×4 PCIe Gen4 PEG (U-Series)
up to 8 PCIe Gen4
up to 2x USB4
4x USB 3.2 Gen2 (incl. USB 2.0) + 8x USB 2.0
up to 2x SATA
2 x UART
GPIOs
SPI
LPC
SM-Bus
I²C
Mass storage
NVMe x4 SSD (optional) up to 1 TB capacity
Graphics
Intel® Arc™ Graphics architecture | up to 8 Xᵉ Cores with 128 EUs
NPU/AI Acceleration
Integrated NPU accelerator on all part numbers
congatec Board Controller
Next Gen 6 congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code
embedded BIOS Features
AMI Aptio® UEFI firmware
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
Security
Trusted Platform Module (TPM 2.0)
Power Management
ACPI 6.0 with battery support
Operating Systems
Microsoft® Windows 11 IoT Enterprise
Microsoft® Windows 11
Microsoft® Windows 10 IoT Enterprise
Linux
Yocto
Hypervisor
Temperature
Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C
Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces
Up to 3x DDI (2x shared with USB4)
LVDS or eDP
4 x independent displays up to 8k
Size
95 x 95 mm (3,74″ x 3,74″)
