Formfactor
3.5”

Board Type
Application Carrier Board for COM HPC Mini Type Modules

Internal IO

• M.2 Key M 2242/3042/2260/2280 (PCIe x4)
• M.2 Key B 2242/3042 (USB2, PCIe x2, SIM)
• M.2 Key E 2230 (USB2, 2x PCIe)
• USB2 header
• SATA III
• Audio header (Mic + Line in) | default via HDA codec | build option for I2S Sound Wire header
• 2x UART
• CAN header
• GP SPI header
• eSPI header
• 12x GPIO by header
• Feature header
• Front Panel header
• SMB header
• 2x I2C header
• 4pin Fan
• SPI boot flash
• RTC CMOS battery holder
• ATX power connector 4-pin

External IO

• 2x 2.5GbE RJ45
• 2x Dual USB 3.2 Type A USB Type C
• DP++
• Audio Jack 4-pin

Power Management
ACPI 5.0a with battery support

Power Secification
DC-In 10 – 24V

Operating Systems

• Microsoft® Windows 11
• Microsoft® Windows 11 IoT Enterprise
• Microsoft® Windows 10
• Microsoft® Windows 10 IoT Enterprise
• Linux
• Yocto

Hypervisor

• RTS Real-Time Hypervisor

Temperature

• Operating: -40 to +85°C
• Storage:  -40 to +85°C

Humidity

• Operating:  10% to 90% r. H. non cond.
• Storage: 5% to 95% r. H. non cond.

Size
146  x 102 mm²