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conga-HPC/3.5-Mini

category: ,
  • Compact Application Carrier for COM-HPC Mini Modules
  • Scalable 3.5” motherboard
  • Longevity by module concept
  • Quick start for COM-HPC Mini designs

Main Features

Formfactor
3.5”

Board Type
Application Carrier Board for COM HPC Mini Type Modules

Internal IO

  • M.2 Key M 2242/3042/2260/2280 (PCIe x4)
  • M.2 Key B 2242/3042 (USB2, PCIe x2, SIM)
  • M.2 Key E 2230 (USB2, 2x PCIe)
  • USB2 header
  • SATA III
  • Audio header (Mic + Line in) | default via HDA codec | build option for I2S Sound Wire header
  • 2x UART
  • CAN header
  • GP SPI header
  • eSPI header
  • 12x GPIO by header
  • Feature header
  • Front Panel header
  • SMB header
  • 2x I2C header
  • 4pin Fan
  • SPI boot flash
  • RTC CMOS battery holder
  • ATX power connector 4-pin

External IO

  • 2x 2.5GbE RJ45
  • 2x Dual USB 3.2 Type A USB Type C
  • DP++
  • Audio Jack 4-pin

Power Management
ACPI 5.0a with battery support

Power Secification
DC-In 10 – 24V

Operating Systems

  • Microsoft® Windows 11
  • Microsoft® Windows 11 IoT Enterprise
  • Microsoft® Windows 10
  • Microsoft® Windows 10 IoT Enterprise
  • Linux
  • Yocto

Hypervisor

  • RTS Real-Time Hypervisor

Temperature

  • Operating: -40 to +85°C
  • Storage:  -40 to +85°C

Humidity

  • Operating:  10% to 90% r. H. non cond.
  • Storage: 5% to 95% r. H. non cond.

Size
146  x 102 mm²

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