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conga-HPC/sILH

category: ,
  • Industrial Use Condition with extended Temperature options
  • 48 PCIe Express lanes
  • AI Capabilities with Intel® DL boost
  • Real Time Capable Platform

Main Features

Formfactor
COM-HPC

CPU
Intel® Xeon® D-2899NT (22 x 2.2 GHz, 30 MB cache, 100G Eth, 135W)
Intel® Xeon® D-2712T (4 x 1.9 GHz, 15 MB cache, 50G Eth, 65W)
Intel® Xeon® D-2733NT (8 x 2.1 GHz, 15 MB cache, 50G Eth, 80W)
Intel® Xeon® D-2752TER (12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)
Intel® Xeon® D-2775TE (16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)
Intel® Xeon® D-2796TE (20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)

DRAM
4x DIMM sockets for DDR4 memory modules | Max. capacity = 512GB*
*Optional 8 sockets on Size E, up to 1TB

Ethernet
1 x 2.5GbE TSN Ethernet
2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)

I/O Interfaces
32 x PCIe Gen4
16 x PCIe Gen3
4 x USB 3.0
4 x USB 2.0
2 x SATA III (6Gb/s)
2 x UART
12 x GPIOs
2 x SM-Bus
2 x I²C bus

congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

embedded BIOS Features
AMI Aptio UEFI
64Mbyte serial SPI with congatec Embedded BIOS feature
OEM Logo
OEM CMOS Defaults
Flash Update

Security
Trusted Platform Module (TPM 2.0)

Power Management
ACPI 5.0 with battery support

Operating Systems
Microsoft® Windows® 10
Microsoft® Windows 10 IoT Enterprise
Microsoft® Windows IoT 10 Core
Linux
Android
Yocto

Hypervisor
RTS Real-Time Hypervisor

Temperature
Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C
Industrial: Operating Temperature: -40 to +80°C | Storage Temperature: -40 to +80°C

Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Size
160 x 160 mm
Optional available on Size E, 200 x 160mm


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